Yanhong Tian

According to our database, Yanhong Tian authored at least 3 papers between 2008 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints.

Ying Ding, Ruyu Tian, Xiuli Wang, Chunjin Hang, Fang Yu, Ling Zhou, Xiangang Meng, Yanhong Tian

Microelectron. Reliab., 2015

2011

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.

Yanhong Tian, Chunjin Hang, Chunqing Wang, G. Q. Ouyang, D. S. Yang, J. P. Zhao

Microelectron. Reliab., 2011

2008

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.

Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou, Honghui Wang

Microelectron. Reliab., 2008