Yangyang Yan

Orcid: 0000-0002-3945-6684

According to our database1, Yangyang Yan authored at least 7 papers between 2014 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2022
DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks.
IEEE ACM Trans. Comput. Biol. Bioinform., 2022

Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data.
Remote. Sens., 2022

Research on Ni<sub>3</sub>Sn<sub>4</sub> intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.
IEICE Electron. Express, 2022

2020
Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model.
Complex., 2020

2016
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab., 2014


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