Yang Zhang

Orcid: 0000-0002-1540-2462

Affiliations:
  • Interuniversity Microelectronics Center (Imec), Leuven, Belgium


According to our database1, Yang Zhang authored at least 8 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2020
2021
2022
2023
2024
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1
2
3
4
5
1
1
4
1
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Legend:

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Links

Online presence:

On csauthors.net:

Bibliography

2024
A D-band Power-Combined Stacked Common-Base Power Amplifier Achieving 20.9 dBm Psat and 24.3 % PAE in a 250-nm InP HBT Technology.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2024

2023
A 0.13μm GaAs HEMT Reconfigurable Balance-to-Doherty Stacked Power Amplifier for 5G mm-wave Applications.
Proceedings of the 18th Conference on Ph.D Research in Microelectronics and Electronics, 2023

A Compact K-band, Asymmetric Coupler-based, Switchless Transmit-Receive Front-End in 0.15μm GaN-on-SiC Technology.
Proceedings of the 49th IEEE European Solid State Circuits Conference, 2023

A 33 dBm, >30% PAE GaN Power Amplifier Based on a Sub-Quarter-Wavelength Balun for 5G Applications.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023

A Compact 0.98 THz Source With On-Chip Antenna In 250-nm InP DHBT.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023

2021
A Low-Power Reflection-Coefficient Sensor for 28-GHz Beamforming Transmitters in 22-nm FD-SOI CMOS.
IEEE J. Solid State Circuits, 2021

26.4 A Reflection-Coefficient Sensor for 28GHz Beamforming Transmitters in 22nm FD-SOI CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020
A flexible power model for mm-wave and THz high-throughput communication systems.
Proceedings of the 31st IEEE Annual International Symposium on Personal, 2020


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