Yang Liu
Orcid: 0000-0001-6981-0974Affiliations:
- Xidian University, School of Microelectronics, Shaanxi Key Lab. of Integrated Circuits and Systems, Xi'an, China
According to our database1,
Yang Liu
authored at least 26 papers
between 2014 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
IEEE Trans. Circuits Syst. II Express Briefs, October, 2024
A 64 × 64 Pixel Image Sensor With Gain-Configurable Photodiodes and Combined Subrange Method.
IEEE Trans. Instrum. Meas., 2024
Frontiers and challenges in silicon-based single-photon avalanche diodes and key readout circuits.
Microelectron. J., 2024
A 7.9 ps Resolution, Multi-Event TDC Using an Ultra-Low Static Phase Error DLL and High Linearity Time Amplifier for dToF Sensors.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024
2023
Microelectron. J., April, 2023
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023
Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023
An Analog SiPM Based Receiver With On-Chip Wideband Amplifier Module for Direct ToF LiDAR Applications.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2023
2022
A Linear-Array Receiver AFE Circuit Embedded 8-to-1 Multiplexer for Direct ToF Imaging LiDAR Applications.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
IEEE Trans. Circuits Syst. I Regul. Pap., 2022
2021
Microelectron. J., 2021
2020
Microelectron. J., 2020
2019
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J., 2019
Microelectron. J., 2019
2018
Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).
IEICE Electron. Express, 2018
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
2016
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse.
Microelectron. Reliab., 2016
J. Circuits Syst. Comput., 2016
An IM2-free floating current buffer using average power based automatic calibration for IEEE 802.15.6 transmitter.
IEICE Electron. Express, 2016
2015
Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs.
Microelectron. Reliab., 2015
A low-distortion multi-bit sigma-delta ADC with mismatch-shaping DACs for WLAN applications.
Microelectron. J., 2015
Modeling and understanding of the frequency dependent HPM upset susceptibility of the CMOS inverter.
Sci. China Inf. Sci., 2015
2014
A fully integrated feedback AGC loop for ZigBee (IEEE 802.15.4) RF transceiver applications.
Microelectron. J., 2014
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2014