Yang Feng
Orcid: 0000-0002-9917-2878Affiliations:
- Donghua University, School of Information Science and Technology, Shanghai, China
According to our database1,
Yang Feng
authored at least 5 papers
between 2019 and 2023.
Collaborative distances:
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Bibliography
2023
Methods of Solving Passband Ripples and Sidelobes for Wavelet Transform Processor Using Surface Acoustic Wave Device.
IEEE Trans. Ind. Electron., 2023
Enhanced Frequency Stability of SAW Yarn Tension Sensor by Using the Dual Differential Channel Surface Acoustic Wave Oscillator.
Sensors, 2023
2022
IEEE Trans. Ind. Electron., 2022
Methods of solving in-band ripples and out-of-band suppression for yarn tension sensor based on surface acoustic wave.
IET Circuits Devices Syst., 2022
2019
Study of the Doubly Clamped Beam Yarn Tension Sensor Based on the Surface Acoustic Wave.
IEEE Trans. Ind. Electron., 2019