Yang Feng

Orcid: 0000-0002-9917-2878

Affiliations:
  • Donghua University, School of Information Science and Technology, Shanghai, China


According to our database1, Yang Feng authored at least 5 papers between 2019 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2023
Methods of Solving Passband Ripples and Sidelobes for Wavelet Transform Processor Using Surface Acoustic Wave Device.
IEEE Trans. Ind. Electron., 2023

Enhanced Frequency Stability of SAW Yarn Tension Sensor by Using the Dual Differential Channel Surface Acoustic Wave Oscillator.
Sensors, 2023

2022
Study on the Practical Application of Surface Acoustic Wave Yarn Tension Sensor.
IEEE Trans. Ind. Electron., 2022

Methods of solving in-band ripples and out-of-band suppression for yarn tension sensor based on surface acoustic wave.
IET Circuits Devices Syst., 2022

2019
Study of the Doubly Clamped Beam Yarn Tension Sensor Based on the Surface Acoustic Wave.
IEEE Trans. Ind. Electron., 2019


  Loading...