Yang Du

According to our database, Yang Du authored at least 14 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs.

Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.

Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs.

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

2016

Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.

Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

BEOL stack-aware routability prediction from placement using data mining techniques.

Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi

Proceedings of the 34th IEEE International Conference on Computer Design, 2016

2015

Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs.

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015

3D VLSI: A Scalable Integration Beyond 2D.

Karim Arabi, Kambiz Samadi, Yang Du

Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications.

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

Proceedings of the 52nd Annual Design Automation Conference, 2015

3DIC benefit estimation and implementation guidance from 2DIC implementation.

Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi

Proceedings of the 52nd Annual Design Automation Conference, 2015

2014

Design and CAD methodologies for low power gate-level monolithic 3D ICs.

Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

Proceedings of the International Symposium on Low Power Electronics and Design, 2014

Full chip impact study of power delivery network designs in monolithic 3D ICs.

Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs.

Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations.

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

High-density integration of functional modules using monolithic 3D-IC technology.

Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013