Yang Chai

According to our database, Yang Chai authored at least 6 papers between 2011 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Two-dimensional materials for future information technology: status and prospects.

Hao Qiu, Zhihao Yu, Tiange Zhao, Qi Zhang, Mingsheng Xu, Peifeng Li, Taotao Li, Wenzhong Bao, Yang Chai, Shula Chen, Yiqi Chen, Hui-Ming Cheng, Daoxin Dai, Zengfeng Di, Zhuo Dong, Xidong Duan, Yuhan Feng, Yu Fu, Jingshu Guo, Pengwen Guo, Yue Hao, Jun He, Xiao He, Jingyi Hu, Weida Hu, Zehua Hu, Xinyue Huang, Ziyang Huang, Ali Imran, Ziqiang Kong, Jia Li, Qian Li, Weisheng Li, Lei Liao, Bilu Liu, Can Liu, Chunsen Liu, Guanyu Liu, Kaihui Liu, Liwei Liu, Sheng Liu, Yuan Liu, Donglin Lu, Likuan Ma, Feng Miao, Zhenhua Ni, Jing Ning, Anlian Pan, Tian-Ling Ren, Haowen Shu, Litao Sun, Yue Sun, Quanyang Tao, Ziao Tian, Dong Wang, Hao Wang, Haomin Wang, Jialong Wang, Junyong Wang, Wenhui Wang, Xingjun Wang, Yeliang Wang, Yuwei Wang, Zhenyu Wang, Yao Wen, Haidi Wu, Hongzhao Wu, Jiangbin Wu, Yanqing Wu, Longfei Xia, Baixu Xiang, Luwen Xing, Qihua Xiong, Xiong Xiong, Jeffrey Xu, Tao Xu, Yang Xu, Liu Yang, Yi Yang, Yuekun Yang, Lei Ye, Yu Ye, Bin Yu, Ting Yu, Hui Zeng, Guangyu Zhang, Hongyun Zhang, Jincheng Zhang, Kai Zhang, Tao Zhang, Xinbo Zhang, Yanfeng Zhang, Chunsong Zhao, Yuda Zhao, Ting Zheng, Peng Zhou, Shaohua Kevin Zhou, Yuxuan Zhu, Deren Yang, Yi Shi, Han Wang, Xinran Wang

Sci. China Inf. Sci., 2024

2023

Editorial: Focus issue on 2D materials for neuromorphic computing.

Feng Miao, J. Joshua Yang, Ilia Valov, Yang Chai

Neuromorph. Comput. Eng., March, 2023

2022

Neuromorphic sensory computing.

Tianqing Wan, Sijie Ma, Fuyou Liao, Lingwei Fan, Yang Chai

Sci. China Inf. Sci., 2022

2021

Low-Power Computing with Neuromorphic Engineering.

Dingbang Liu, Hao Yu, Yang Chai

Adv. Intell. Syst., 2021

2019

Energy Saving in Metro Transit Substation through Train Trajectory Optimization.

Bo Jin, Xiaoyun Feng, Pengfei Sun, Mo Chen, Yang Chai

Proceedings of the 2019 IEEE Intelligent Transportation Systems Conference, 2019

2011

Towards future VLSI interconnects using aligned carbon nanotubes.

Yang Chai, Minghui Sun, Zhiyong Xiao, Yuan Li, Min Zhang, Philip C. H. Chan

Proceedings of the IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, 2011