Yan Cheong Chan
According to our database1,
Yan Cheong Chan
authored at least 6 papers
between 2002 and 2004.
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Bibliography
2004
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.
Microelectron. Reliab., 2004
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.
Microelectron. Reliab., 2004
2003
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.
Microelectron. Reliab., 2003
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectron. Reliab., 2003
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy.
Microelectron. Reliab., 2003
2002
Microelectron. Reliab., 2002