Yabin Zhang

Orcid: 0000-0001-5910-163X

Affiliations:

Xihua University, School of Electrical Engineering and Electronic Information, Sichuan, China
University of Pisa, Department of Information Engineering, Italy (PhD 2013)

According to our database¹, Yabin Zhang authored at least 4 papers between 2010 and 2021.

Collaborative distances:

Timeline

Book

In proceedings

Article

PhD thesis

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2021

Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components' Temperature.

[BibT_eX]

[DOI]

IEEE Access, 2021

2014

A modeling methodology for thermal analysis of the PCB structure.

[BibT_eX]

[DOI]

Microelectron. J., 2014

2013

Modeling Methodology for Reliability-Concerned Current Density Analysis of PCB Tracks and Thermal Analysis of PCB Structure.

[BibT_eX]

[DOI]

PhD thesis, 2013

2010

Electro-thermal simulation of metal interconnections under high current flow.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2010