Y. J. Huang

According to our database, Y. J. Huang authored at least 3 papers between 2005 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.

Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology.

Yen-Ting Chiang, Yean-Kuen Fang, Y. J. Huang, Tse-Heng Chou, S. Y. Yeh, C. S. Lin

Microelectron. Reliab., 2008

2005

Self-tuning sliding mode control with smooth control input.

Y. J. Huang, S. H. Chang

Proceedings of the CIRA 2005, 2005