Y. F. Yao

According to our database, Y. F. Yao authored at least 7 papers between 1989 and 2005.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2005

New encapsulation development for fine pitch IC devices.

Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin

Microelectron. Reliab., 2005

2003

Improving the deflection of wire bonds in stacked chip scale package (CSP).

Y. F. Yao, T. Y. Lin, K. H. Chua

Microelectron. Reliab., 2003

Development of the green plastic encapsulation for high density wirebonded leaded packages.

T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua

Microelectron. Reliab., 2003

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.

T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu

Microelectron. Reliab., 2003

1997

Parallel CFD Computation on Unstructured Grids.

Y. F. Yao, Brian E. Richards

Proceedings of the Conference on Parallel Computational Fluid Dynamics 1997, 1997

1990

Optimum removal of LCOs in digital filters.

Y. Z. Zhang, T. W. Cole, Y. F. Yao

Proceedings of the 1990 International Conference on Acoustics, 1990

1989

Fast implementation of recursive DFTs.

Y. Z. Zhang, Y. F. Yao

Proceedings of the IEEE International Conference on Acoustics, 1989