Xuejun Fan
Orcid: 0000-0003-0525-4424
According to our database1,
Xuejun Fan
authored at least 28 papers
between 2004 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Hypergolic Ignition by Off-Center Binary Collision of Monoethanolamine-NaBH4 and Hydrogen Peroxide Droplets.
Symmetry, June, 2024
2020
Proceedings of the Information Security and Cryptology - 16th International Conference, 2020
Proceedings of the Information Security and Cryptology - 16th International Conference, 2020
2019
Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.
IEEE Access, 2019
Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019
Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields.
Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019
2018
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.
Sensors, 2018
Reliab. Eng. Syst. Saf., 2018
A new hermetic sealing method for ceramic package using nanosilver sintering technology.
Microelectron. Reliab., 2018
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging.
Microelectron. Reliab., 2018
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.
Microelectron. Reliab., 2018
2017
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.
Reliab. Eng. Syst. Saf., 2017
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
Microelectron. Reliab., 2017
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method.
Microelectron. Reliab., 2017
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.
IEEE Access, 2017
Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method.
IEEE Access, 2017
2016
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.
IEEE Trans. Ind. Electron., 2016
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.
Reliab. Eng. Syst. Saf., 2016
2015
Microelectron. Reliab., 2015
2012
Microelectron. Reliab., 2012
2010
Finite element modeling on electromigration of solder joints in wafer level packages.
Microelectron. Reliab., 2010
2004
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.
Microelectron. Reliab., 2004