Xuejun Fan

Orcid: 0000-0003-0525-4424

According to our database1, Xuejun Fan authored at least 28 papers between 2004 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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On csauthors.net:

Bibliography

2024
Hypergolic Ignition by Off-Center Binary Collision of Monoethanolamine-NaBH4 and Hydrogen Peroxide Droplets.
Symmetry, June, 2024

2020
Group Key Exchange Protocols from Supersingular Isogenies.
Proceedings of the Information Security and Cryptology - 16th International Conference, 2020

CSURF-TWO: CSIDH for the Ratio (2 : 1).
Proceedings of the Information Security and Cryptology - 16th International Conference, 2020

2019
CSIDH on Other Form of Elliptic Curves.
IACR Cryptol. ePrint Arch., 2019

A Reliability Prediction Methodology for LED Arrays.
IEEE Access, 2019

Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.
IEEE Access, 2019

Speeding up Scalar Multiplication on Koblitz Curves Using \mu _4 Coordinates.
Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019

Constructing Hyperelliptic Covers for Elliptic Curves over Quadratic Extension Fields.
Proceedings of the Information Security and Privacy - 24th Australasian Conference, 2019

2018
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene.
Sensors, 2018

A stochastic process based reliability prediction method for LED driver.
Reliab. Eng. Syst. Saf., 2018

A new hermetic sealing method for ceramic package using nanosilver sintering technology.
Microelectron. Reliab., 2018

In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging.
Microelectron. Reliab., 2018

A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.
Microelectron. Reliab., 2018

2017
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation.
Reliab. Eng. Syst. Saf., 2017

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
Microelectron. Reliab., 2017

Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method.
Microelectron. Reliab., 2017

Color shift acceleration on mid-power LED packages.
Microelectron. Reliab., 2017

Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages.
Microelectron. Reliab., 2017

Modeling nonlinear moisture diffusion in inhomogeneous media.
Microelectron. Reliab., 2017

Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm.
IEEE Access, 2017

Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method.
IEEE Access, 2017

2016
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers.
IEEE Trans. Ind. Electron., 2016

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test.
Reliab. Eng. Syst. Saf., 2016

2015
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests.
Microelectron. Reliab., 2015

2012
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds.
Microelectron. Reliab., 2012

2010
Advances in Wafer Level Packaging (WLP).
Microelectron. Reliab., 2010

Finite element modeling on electromigration of solder joints in wafer level packages.
Microelectron. Reliab., 2010

2004
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling.
Microelectron. Reliab., 2004


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