Xu Fang

Orcid: 0000-0002-0069-6437

Affiliations:
  • Heilongjiang University, School of Electronic Engineering, Harbin, China
  • Harbin Institute of Technology, Department of electrical engineering and automation, China (PhD 2019)


According to our database1, Xu Fang authored at least 5 papers between 2018 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2018
2019
2020
2021
2022
2023
2024
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1
2
1
1
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Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
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Links

Online presence:

On csauthors.net:

Bibliography

2024
A Post-Bond ILV Test Method in Monolithic 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst., December, 2024

2022
The Detection of Open and Leakage Faults for Prebond TSV Test Based on Weak Current Source.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

2020
A Post-Bond TSV Test Method Based on RGC Parameters Measurement.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

2019
TSV Prebond Test Method Based on Switched Capacitors.
IEEE Trans. Very Large Scale Integr. Syst., 2019

2018
TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement.
IEEE Access, 2018


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