Xingsheng Liu

According to our database, Xingsheng Liu authored at least 6 papers between 2001 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Trigonometric projection statistics histograms for 3D local feature representation and shape description.

Xingsheng Liu, Anhu Li, Jianfeng Sun, Zhiyong Lu

Pattern Recognit., November, 2023

Research on seamless image stitching based on fast marching method.

Weidong Pan, Anhu Li, Yusheng Wu, Zhaojun Deng, Xingsheng Liu

IET Image Process., 2023

2005

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.

Y. C. Lin, Xu Chen, Xingsheng Liu, Guo-Quan Lu

Microelectron. Reliab., 2005

2002

Effect of substrate flexibility on solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2002

2001

Stacked solder bumping technology for improved solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2001

Design issues of a three-dimensional packaging scheme for power modules.

Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu

Microelectron. Reliab., 2001