Xingna Hou

According to our database, Xingna Hou authored at least 7 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

A Defect Detection Method of Mixed Wafer Map Using Neighborhood Path Filtering Clustering Algorithm.

Xingna Hou, Guanxiang Qin, Ying Lu, Mulan Yi, Shouhong Chen

J. Electron. Test., August, 2024

Mixed-type wafer defect detection based on multi-branch feature enhanced residual module.

Shouhong Chen, Zhentao Huang, Tao Wang, Xingna Hou, Jun Ma

Expert Syst. Appl., 2024

2023

Detection Method of Hardware Trojan Based on Attention Mechanism and Residual-Dense-Block under the Markov Transition Field.

Shouhong Chen, Tao Wang, Zhentao Huang, Xingna Hou

J. Electron. Test., December, 2023

Wafer map defect pattern detection method based on improved attention mechanism.

Shouhong Chen, Meiqi Liu, Xingna Hou, Ziren Zhu, Zhentao Huang, Tao Wang

Expert Syst. Appl., November, 2023

Detection method of Golden Chip-Free Hardware Trojan based on the combination of ResNeXt structure and attention mechanism.

Shouhong Chen, Tao Wang, Zhentao Huang, Xingna Hou

Comput. Secur., November, 2023

2022

Wafer map failure pattern recognition based on deep convolutional neural network.

Shouhong Chen, Yuxuan Zhang, Xingna Hou, Yuling Shang, Ping Yang

Expert Syst. Appl., 2022

2019

Research on TSV Void Defects Based on Machine Learning.

Shouhong Chen, Huaiqiang Kang, Jun Ma, Ling Guo, Xingna Hou

Proceedings of the 3rd International Conference on Computer Science and Application Engineering, 2019