Xin Huang

Affiliations:
  • University of California at Riverside, Department of Electrical and Computer Engineering, CA, USA


According to our database1, Xin Huang authored at least 21 papers between 2013 and 2017.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2017
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.
Integr., 2017

2016
Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits
PhD thesis, 2016

Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Electromigration assessment for power grid networks considering temperature and thermal stress effects.
Integr., 2016

EM-Based On-Chip Aging Sensor for Detection of Recycled ICs.
IEEE Des. Test, 2016

Voltage-based electromigration immortality check for general multi-branch interconnects.
Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Learning-based dynamic reliability management for dark silicon processor considering EM effects.
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016

Physics-based full-chip TDDB assessment for BEOL interconnects.
Proceedings of the 53rd Annual Design Automation Conference, 2016

Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015
Task Migrations for Distributed Thermal Management Considering Transient Effects.
IEEE Trans. Very Large Scale Integr. Syst., 2015

<i>H</i>-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs.
ACM Trans. Design Autom. Electr. Syst., 2015

H<sup>2</sup>-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs.
Int. J. Circuit Theory Appl., 2015

EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Interconnect reliability modeling and analysis for multi-branch interconnect trees.
Proceedings of the 52nd Annual Design Automation Conference, 2015

New electromigration modeling and analysis considering time-varying temperature and current densities.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014
Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014

IR-drop based electromigration assessment: parametric failure chip-scale analysis.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Accurate full-chip estimation of power map, current densities and temperature for EM assessment.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Physics-based Electromigration Assessment for Power Grid Networks.
Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013
Distributed task migration for thermal hot spot reduction in many-core microprocessors.
Proceedings of the IEEE 10th International Conference on ASIC, 2013


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