Xin Huang
Affiliations:- University of California at Riverside, Department of Electrical and Computer Engineering, CA, USA
According to our database1,
Xin Huang
authored at least 21 papers
between 2013 and 2017.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2017
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.
Integr., 2017
2016
Physics-Based Electromigration and Time Dependent Dielectric Breakdown Modeling and Reliability Analysis for Nanometer VLSI Circuits
PhD thesis, 2016
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
Electromigration assessment for power grid networks considering temperature and thermal stress effects.
Integr., 2016
Voltage-based electromigration immortality check for general multi-branch interconnects.
Proceedings of the 35th International Conference on Computer-Aided Design, 2016
Learning-based dynamic reliability management for dark silicon processor considering EM effects.
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016
Proceedings of the 53rd Annual Design Automation Conference, 2016
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016
2015
IEEE Trans. Very Large Scale Integr. Syst., 2015
ACM Trans. Design Autom. Electr. Syst., 2015
H<sup>2</sup>-matrix-based finite element linear solver for fast transient thermal analysis of high-performance ICs.
Int. J. Circuit Theory Appl., 2015
EM-Based on-Chip Aging Sensor for Detection and Prevention of Counterfeit and Recycled ICs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015
Proceedings of the 52nd Annual Design Automation Conference, 2015
New electromigration modeling and analysis considering time-varying temperature and current densities.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015
2014
Direct finite-element-based solver for 3D-IC thermal analysis via H-matrix representation.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Accurate full-chip estimation of power map, current densities and temperature for EM assessment.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Proceedings of the 51st Annual Design Automation Conference 2014, 2014
2013
Distributed task migration for thermal hot spot reduction in many-core microprocessors.
Proceedings of the IEEE 10th International Conference on ASIC, 2013