Xiaoxian Liu

According to our database, Xiaoxian Liu authored at least 26 papers between 2013 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

An Evaluation of Ecosystem Quality and Its Response to Aridity on the Qinghai-Tibet Plateau.

Yimeng Yan, Jiaxi Cao, Yufan Gu, Xuening Huang, Xiaoxian Liu, Yue Hu, Shuhong Wu

Remote. Sens., September, 2024

2023

A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components.

Lei Wang, Xiaoxian Liu, Chengyang Luo, Zhangming Zhu

IEEE Trans. Circuits Syst. II Express Briefs, December, 2023

A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression.

Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang

Microelectron. J., March, 2023

A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields.

Lei Wang, Xiaoxian Liu, Yunfei En, Zhangming Zhu

IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.

Xiaoxian Liu, Yang Liu, Tao Zhang, Qijun Lu, Zhangming Zhu

IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

Filtering SIW phase shifter based on through quartz vias technology.

Nuo Liu, Xiaoxian Liu, Chenhui Fan

Microelectron. J., 2023

2022

An effective method to suppress high-order modes of SIW filters with compact size.

Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang, Zhangming Zhu

Microelectron. J., 2022

2021

Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications.

Chenbing Qu, Zhangming Zhu, Yunfei En, Liwei Wang, Xiaoxian Liu

IEEE Trans. Very Large Scale Integr. Syst., 2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu

Microelectron. J., 2021

2020

Voltage Reference With Linear-Temperature-Dependent Power Consumption.

Haoyu Zhuang, Xiaoxian Liu, Hao Wang

IEEE Trans. Very Large Scale Integr. Syst., 2020

Voltage Comparator With 60% Faster Speed by Using Charge Pump.

Haoyu Zhuang, He Tang, Xiaoxian Liu

IEEE Trans. Circuits Syst., 2020

Physics based scalable inductance model for three-dimensional solenoid inductors.

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang

Microelectron. J., 2020

2019

Electromagnetic modeling and analysis of the tapered differential through glass vias.

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang

Microelectron. J., 2019

Broadband inductance modeling of TXVs for 3D interconnection.

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Lixin Guo, Yintang Yang

Microelectron. J., 2019

2018

Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Huaxi Gu, Lixin Guo

IEICE Electron. Express, 2018

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang

Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2014

Capacitance characterization of tapered through-silicon-via considering MOS effect.

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

Microelectron. J., 2014

Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.

Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding

IEICE Electron. Express, 2014

A multiscale region-based approach to automatic SAR image registration using CLPSO.

Guiting Wang, Xiaoxian Liu, Licheng Jiao, Shuang Wang

Proceedings of the 2014 IEEE Geoscience and Remote Sensing Symposium, 2014

2013

Thermo-mechanical performance of Cu and SiO₂ filled coaxial through-silicon-via (TSV).

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

IEICE Electron. Express, 2013

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

IEICE Electron. Express, 2013

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.

Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding

IEICE Electron. Express, 2013

Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588].

Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao

IEICE Electron. Express, 2013

The impact of trapping centers on AlGaN/GaN resonant tunneling diode.

Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao

IEICE Electron. Express, 2013

An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP.

Xiaoxian Liu, Rongcai Zhao, Lin Han, Peng Liu

Proceedings of the 12th IEEE International Conference on Trust, 2013

A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization.

Xiaoxian Liu, Rongcai Zhao, Lin Han

Proceedings of the 14th ACIS International Conference on Software Engineering, 2013