Xiaohe Liu
According to our database1,
Xiaohe Liu
authored at least 6 papers
between 2007 and 2019.
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Bibliography
2019
A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging.
IEEE Trans. Ind. Informatics, 2019
2018
Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.
IEEE Trans. Ind. Informatics, 2018
Proceedings of the 40th International Conference on Software Engineering: Companion Proceeedings, 2018
2017
IEEE Trans. Ind. Informatics, 2017
2016
Proceedings of the 14th International Conference on Control, 2016
2007
Proceedings of the Advances in Neural Networks, 2007