Xiangning Lu

Orcid: 0000-0002-2932-0185

According to our database1, Xiangning Lu authored at least 14 papers between 2013 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Continuous Wavelet Transform Peak-Seeking Attention Mechanism Conventional Neural Network: A Lightweight Feature Extraction Network with Attention Mechanism Based on the Continuous Wave Transform Peak-Seeking Method for Aero-Engine Hot Jet Fourier Transform Infrared Classification.
Remote. Sens., August, 2024

2023
Near-Space Wide-Area and High-Resolution Imaging System Design and Implementation.
Sensors, July, 2023

Mechanical Shutter Testing System Design and Signal Processing Based on LabVIEW.
Proceedings of the IEEE International Conference on Signal Processing, 2023

2022
Improved Active Disturbance Rejection Double Closed-Loop Control of a Rotary-Type VCM in a Moving Mirror Control System.
Sensors, 2022

2020
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls.
IEEE Trans. Ind. Informatics, 2020

2018
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.
IEEE Trans. Ind. Informatics, 2018

2017
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps.
Microelectron. Reliab., 2017

Principle and analysis of a rotational motion Fourier transform infrared spectrometer.
Proceedings of the Earth Observing Systems XXII, 2017

2016
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm.
Microelectron. Reliab., 2016

2015
Genetic algorithms for defect detection of flip chips.
Microelectron. Reliab., 2015

2014
A new gear fault feature extraction method based on hybrid time-frequency analysis.
Neural Comput. Appl., 2014

Using active thermography for defects inspection of flip chip.
Microelectron. Reliab., 2014

2013
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.
Sensors, 2013

A high speed railway control system based on the fuzzy control method.
Expert Syst. Appl., 2013


  Loading...