Xiangkun Yin

According to our database, Xiangkun Yin authored at least 17 papers between 2015 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

A compact fifth-order SIW BPF based on TSV technology with high selectivity.

Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li

Microelectron. J., February, 2024

2023

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.

Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang

Microelectron. J., 2023

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.

Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2023

2022

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.

Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEEE Trans. Very Large Scale Integr. Syst., 2022

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.

Xiangkun Yin, Jingyu Lu, Fengjuan Wang

Microelectron. J., 2022

Compact high-performance dual-frequency power divider based on TSV.

Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang

Microelectron. J., 2022

Wideband transmission optimization for heterogenous interconnection in 3D IC.

Xiangkun Yin, Jingyu Lu, Fengjuan Wang

IEICE Electron. Express, 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.

Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2022

2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu

Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.

Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang

Integr., 2021

Analytical models of AC inductance and quality factor for TSV-based inductor.

Xiangkun Yin, Fengjuan Wang

IEICE Electron. Express, 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.

Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.

Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEEE Access, 2021

2020

Physics based scalable inductance model for three-dimensional solenoid inductors.

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang

Microelectron. J., 2020

2019

Electromagnetic modeling and analysis of the tapered differential through glass vias.

Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang

Microelectron. J., 2019

2018

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang

Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2015

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.

Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang

IEICE Electron. Express, 2015