Xian Tong Chen
According to our database1,
Xian Tong Chen
authored at least 2 papers
between 2005 and 2012.
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Bibliography
2012
Modular sensor chip design for package stress evaluation and reliability characterisation.
Microelectron. Reliab., 2012
2005
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
Microelectron. Reliab., 2005