X. Perpiñà
Orcid: 0000-0001-5946-5580
According to our database1,
X. Perpiñà
authored at least 32 papers
between 2004 and 2024.
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Online presence:
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Bibliography
2024
Physics-Based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs.
IEEE Trans. Ind. Electron., May, 2024
Measurement Uncertainty in Fourier Coefficient- Based Time Series Reconstruction Considering Calibration Effects in Thermal Imaging.
IEEE Trans. Instrum. Meas., 2024
2023
Die-Level Transient Thermal Imaging Based on Fourier Series Reconstruction for Power Industrial Electronics.
IEEE Trans. Instrum. Meas., 2023
2021
IEEE Trans. Ind. Electron., 2021
2019
Output Power and Gain Monitoring in RF CMOS Class A Power Amplifiers by Thermal Imaging.
IEEE Trans. Instrum. Meas., 2019
Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices.
IEEE Trans. Ind. Electron., 2019
2017
IEEE Trans. Ind. Electron., 2017
2015
Functional and Consumption Analysis of Integrated Circuits Supplied by Inductive Power Transfer by Powering Modulation and Lock-In Infrared Imaging.
IEEE Trans. Ind. Electron., 2015
Microelectron. J., 2015
2014
Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications.
Microelectron. Reliab., 2014
Microelectron. Reliab., 2014
Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers.
Microelectron. J., 2014
Review of temperature sensors as monitors for RF-MMW built-in testing and self-calibration schemes.
Proceedings of the IEEE 57th International Midwest Symposium on Circuits and Systems, 2014
Study of surface weak spots on SiC Schottky Diodes under specific operating regimes by Infrared Lock-in sensing.
Proceedings of the 44th European Solid State Device Research Conference, 2014
2013
Microelectron. Reliab., 2013
2012
Microelectron. Reliab., 2012
Microelectron. Reliab., 2012
Microelectron. Reliab., 2012
Proceedings of the 2012 IEEE International Test Conference, 2012
2011
Analysis of Clamped Inductive Turnoff Failure in Railway Traction IGBT Power Modules Under Overload Conditions.
IEEE Trans. Ind. Electron., 2011
IEEE Trans. Ind. Electron., 2011
IEEE Trans. Ind. Electron., 2011
2008
2007
Local thermal cycles determination in thermosyphon-cooled traction IGBT modules reproducing mission profiles.
Microelectron. Reliab., 2007
Failure-relevant abnormal events in power inverters considering measured IGBT module temperature inhomogeneities.
Microelectron. Reliab., 2007
Microelectron. Reliab., 2007
Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications.
Microelectron. Reliab., 2007
2006
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current.
Microelectron. Reliab., 2006
2004
Microelectron. J., 2004