Wonhoon Park

According to our database1, Wonhoon Park authored at least 12 papers between 2022 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
NeRF-Navi: A 93.6-202.9µJ/task Switchable Approximate-Accurate NeRF Path Planning Processor with Dual Attention Engine and Outlier Bit-Offloading Core.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

A 3.55 mJ/frame Energy-efficient Mixed-Transformer based Semantic Segmentation Accelerator for Mobile Devices.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

A 28.6 mJ/iter Stable Diffusion Processor for Text-to-Image Generation with Patch Similarity-based Sparsity Augmentation and Text-based Mixed-Precision.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

NeuGPU: A Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile AR/VR Devices.
Proceedings of the 36th IEEE Hot Chips Symposium, 2024

A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2024

2023
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation.
IEEE Micro, 2023

DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC.
IEEE J. Solid State Circuits, 2023

A 5.99 TFLOPS/W Heterogeneous CIM-NPU Architecture for an Energy Efficient Floating-Point DNN Acceleration.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

A Resource-Efficient Super-Resolution FPGA Processor with Heterogeneous CNN and SNN Core Architecture.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2023

2022
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip.
Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022

A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2022


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