Winco K. C. Yung
Orcid: 0000-0002-2218-3632
According to our database1,
Winco K. C. Yung
authored at least 7 papers
between 2009 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
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Online presence:
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on orcid.org
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Bibliography
2024
J. Intell. Manuf., March, 2024
2021
Expert Syst. Appl., 2021
2015
A return on investment analysis of applying health monitoring to LED lighting systems.
Microelectron. Reliab., 2015
2011
Effect of additions of ZrO<sub>2</sub> nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads.
Microelectron. Reliab., 2011
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO<sub>2</sub> composite solder on flexible ball grid array substrates.
Microelectron. Reliab., 2011
2010
Effect of nano Al<sub>2</sub>O<sub>3</sub> additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads.
Microelectron. Reliab., 2010
2009
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages.
Microelectron. Reliab., 2009