William E. Stanchina

According to our database, William E. Stanchina authored at least 5 papers between 1997 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Sustainable IC design and fabrication.

Donald Kline Jr., Nikolas Parshook, Alex Johnson, James E. Stine, William E. Stanchina, Erik Brunvand, Alex K. Jones

Proceedings of the Eighth International Green and Sustainable Computing Conference, 2017

2003

100+ GHz static divide-by-2 circuit in InP-DHBT technology.

Mehran Mokhtari, Charles H. Fields, Rajesh D. Rajavel, Marko Sokolich, Joseph F. Jensen, William E. Stanchina

IEEE J. Solid State Circuits, 2003

2000

High-gain transimpedance amplifier in InP-based HBT technology for the receiver in 40-Gb/s optical-fiber TDM links.

Jens Müllrich, Herbert Thurner, Ernst Müllner, Joseph F. Jensen, William E. Stanchina, Michael Kardos, Hans-Martin Rein

IEEE J. Solid State Circuits, 2000

1998

InP-HBT-based VHSICs and OEICs for optical fiber communication systems.

Mehran Mokhtari, Urban Westergren, Bo Willén, Thomas Swahn, William E. Stanchina

Proceedings of the 5th IEEE International Conference on Electronics, Circuits and Systems, 1998

1997

InP-HBT chip-set for 40-Gb/s fiber optical communication systems operational at 3 V.

Mehran Mokhtari, Thomas Swahn, Robert H. Walden, William E. Stanchina, Michael Kardos, Tarja Juhola, Gerd Schuppener, Hannu Tenhunen, Thomas Lewin

IEEE J. Solid State Circuits, 1997