Wentian Jin

According to our database1, Wentian Jin authored at least 19 papers between 2019 and 2023.

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Bibliography

2023
Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2023

Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2023

GridNetOpt: Fast Full-Chip EM-Aware Power Grid Optimization Accelerated by Deep Neural Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2023

PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023

Learning Based Spatial Power Characterization and Full-Chip Power Estimation for Commercial TPUs.
Proceedings of the 28th Asia and South Pacific Design Automation Conference, 2023

2022
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022

Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks.
Proceedings of the 27th Asia and South Pacific Design Automation Conference, 2022

2021
Special Session: Machine Learning for Semiconductor Test and Reliability.
Proceedings of the 39th IEEE VLSI Test Symposium, 2021

Fast Electrostatic Analysis For VLSI Aging based on Generative Learning.
Proceedings of the 3rd ACM/IEEE Workshop on Machine Learning for CAD, 2021

Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021

EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks.
Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021

2020
EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks.
CoRR, 2020

Data-Driven Fast Electrostatics and TDDB Aging Analysis.
Proceedings of the MLCAD '20: 2020 ACM/IEEE Workshop on Machine Learning for CAD, 2020

EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects.
Proceedings of the 38th IEEE International Conference on Computer Design, 2020

GridNet: Fast Data-Driven EM-Induced IR Drop Prediction and Localized Fixing for On-Chip Power Grid Networks.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors.
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019
GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem.
CoRR, 2019


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