Wenke Weinreich

According to our database, Wenke Weinreich authored at least 7 papers between 2013 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Enablement of CMOS integrated sensor, harvesting and storage applications by ferroelectric HfO2.

Wenke Weinreich, Maximilian Lederer, Malte Czernohorsky

Proceedings of the International Conference on IC Design and Technology, 2022

2019

IPCEI subcontracts contributing to 22-FDX Add-On Functionalities at GF.

Sabine Kolodinski, Boli Peng, Ciro Esposito, Yves Zimmermann, Michael Schröter, Xin Xu, Paolo Valerio Testa, Corrado Carta, Frank Ellinger, Steffen Lehmann, M. Drescher, Clemens Mart, Maciej Wiatr, Wenke Weinreich, Violetta Sessi, Jens Trommer, Talha Chohan, Halid Mulaosmanovic, Walter M. Weber, Stefan Slesazeck

Proceedings of the 49th European Solid-State Device Research Conference, 2019

2018

CMOS Compatible Pyroelectric Applications Enabled by Doped HfO2 Films on Deep-Trench Structures.

Clemens Mart, Wenke Weinreich, Malte Czernohorsky, Stefan Riedel, S. Zybell, Kü Kuhnel

Proceedings of the 48th European Solid-State Device Research Conference, 2018

2016

La-doped ZrO2 based BEoL decoupling capacitors.

Wenke Weinreich, Konrad Seidel, Patrick Polakowski, Maximilian Drescher, A. Gummenscheimer, Mark G. Nolan, L. Cheng, D. H. Triyoso

Proceedings of the International Conference on IC Design and Technology, 2016

2014

ALD ZrO2 processes for BEoL device applications.

Wenke Weinreich, Konrad Seidel, Patrick Polakowski, Stefan Riedel, Lutz Wilde, Dina H. Triyoso, Mark G. Nolan

Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014

ALD Ta2O5 and Hf-doped Ta2O5 for BEOL compatible MIM.

D. H. Triyoso, Wenke Weinreich, Konrad Seidel, Mark G. Nolan, Patrick Polakowski, D. Utess, Susanne Ohsiek, K. Dittmar, M. Weisheit, M. Licbau, R. Fox

Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014

2013

High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures.

Wenke Weinreich, Matthias Rudolph, Johannes Koch, Jan Paul, Konrad Seidel, Stefan Riedel, Jonas Sundqvist, Katja Steidel, Manuela Gutsch, Volkhard Beyer, Christoph Hohle

Proceedings of 2013 International Conference on IC Design & Technology, 2013