Weng Hong Teh

According to our database, Weng Hong Teh authored at least 2 papers between 2009 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.

Weng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.

Weng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O'Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang, David Marx, David Grant, Russ Dudley

Proceedings of the IEEE International Conference on 3D System Integration, 2009