Wen-Kun Yang

According to our database, Wen-Kun Yang authored at least 1 paper in 2008.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2008

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact.

Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang

Microelectron. Reliab., 2008