Weishen Chu

According to our database, Weishen Chu authored at least 5 papers between 2020 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Complex characteristics analysis of time-delay digital supply chain driven by cybersecurity.

Daoming Dai, Xuanyu Wu, Fengshan Si, Zhenan Feng, Weishen Chu

Kybernetes, 2023

2022

Underwater image restoration via backscatter pixel prior and color compensation.

Jingchun Zhou, Tongyu Yang, Weishen Chu, Weishi Zhang

Eng. Appl. Artif. Intell., 2022

Underwater image enhancement method with light scattering characteristics.

Jingchun Zhou, Xiaojing Wei, Jinyu Shi, Weishen Chu, Weishi Zhang

Comput. Electr. Eng., 2022

An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction.

Weishen Chu, Seyyed Ehsan Esfahani Rashidi, Yanli Zhang, Johann Alsmeier, Toshiyuki Sega

Proceedings of the IEEE International Memory Workshop, 2022

2020

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips.

Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020