Wei W. Xing
Orcid: 0000-0002-3177-8478
According to our database1,
Wei W. Xing
authored at least 39 papers
between 2016 and 2024.
Collaborative distances:
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Bibliography
2024
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2024
An End-to-End In-Memory Computing System Based on a 40-nm eFlash-Based IMC SoC: Circuits, Toolchains, and Systems Co-Design Framework.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024
LVF2: A Statistical Timing Model based on Gaussian Mixture for Yield Estimation and Speed Binning.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
Every Failure Is A Lesson: Utilizing All Failure Samples To Deliver Tuning-Free Efficient Yield Evaluation.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
KATO: Knowledge Alignment And Transfer for Transistor Sizing Of Different Design and Technology.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
Unleashing the Potential of AQFP Logic Placement via Entanglement Entropy and Projection.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
CIS: Conditional Importance Sampling for Yield Optimization of Analog and SRAM Circuits.
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
Proceedings of the International Conference on Artificial Intelligence and Statistics, 2024
Proceedings of the International Conference on Artificial Intelligence and Statistics, 2024
2023
ACM Trans. Design Autom. Electr. Syst., March, 2023
Differentiable Multi-Fidelity Fusion: Efficient Learning of Physics Simulations with Neural Architecture Search and Transfer Learning.
CoRR, 2023
OPT: Optimal Proposal Transfer for Efficient Yield Optimization for Analog and SRAM Circuits.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
Seeking the Yield Barrier: High-Dimensional SRAM Evaluation Through Optimal Manifold.
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
High-Dimensional Yield Estimation Using Shrinkage Deep Features and Maximization of Integral Entropy Reduction.
Proceedings of the 28th Asia and South Pacific Design Automation Conference, 2023
2022
Mission Replanning for Multiple Agile Earth Observation Satellites Based on Cloud Coverage Forecasting.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2022
Proceedings of the Advances in Neural Information Processing Systems 35: Annual Conference on Neural Information Processing Systems 2022, 2022
Proceedings of the International Joint Conference on Neural Networks, 2022
Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022
Proceedings of the DAC '22: 59th ACM/IEEE Design Automation Conference, San Francisco, California, USA, July 10, 2022
Proceedings of the International Conference on Artificial Intelligence and Statistics, 2022
2021
Deep coregionalization for the emulation of simulation-based spatial-temporal fields.
J. Comput. Phys., 2021
Residual Gaussian Process: A Tractable Nonparametric Bayesian Emulator for Multi-fidelity Simulations.
CoRR, 2021
Proceedings of the 24th International Conference on Artificial Intelligence and Statistics, 2021
2020
Proceedings of the Advances in Neural Information Processing Systems 33: Annual Conference on Neural Information Processing Systems 2020, 2020
Proceedings of the Twenty-Ninth International Joint Conference on Artificial Intelligence, 2020
Proceedings of the Thirty-Fourth AAAI Conference on Artificial Intelligence, 2020
2019
Proceedings of the Information Processing in Medical Imaging, 2019
Proceedings of the 22nd International Conference on Artificial Intelligence and Statistics, 2019
2017
Prediction of impurities in hydrogen fuel supplies using a thermally-modulated CMOS gas sensor: Experiments and modelling.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017
2016
J. Comput. Phys., 2016