Wei Ling

According to our database, Wei Ling authored at least 10 papers between 2005 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

SeeSaw: Learning Soft Tissue Deformation From Laparoscopy Videos With GNNs.

Reuben Docea, Jinjing Xu, Wei Ling, Alexander C. Jenke, Fiona R. Kolbinger, Marius Distler, Carina Riediger, Jürgen Weitz, Stefanie Speidel, Micha Pfeiffer

IEEE Trans. Biomed. Eng., December, 2024

Modeling and optimization of energy consumption in wire cut electrical discharge machining.

Jun Zheng, Yicheng Ren, Tiening Qi, Feng Lin, Junjie Shi, Xinyu Hu, Qi Pan, Jinkang Yao, Wei Ling, Aizhi Guan, Zhiyi Zhang, Fubin Duan

Comput. Ind. Eng., 2024

2023

An influence modelling and analysis method of reducing carbon emissions for mould forming processes in patternless sand casting.

Jun Zheng, Jinkang Yao, Yicheng Ren, Junjie Shi, Feng Lin, Wei Ling, Tao Peng, Wei Wang

Int. J. Prod. Res., March, 2023

A Miniaturized Flexible Optoelectronic System for Implantable Fluorescence Sensing.

Wei Ling, Xue Shang, Yina Wei, Linqing Feng, Tao Tang

Proceedings of the IEEE International Conference on Integrated Circuits, 2023

2022

Geometrically-Shaped Multi-Dimensional Modulation Formats in Coherent Optical Transmission Systems.

Bin Chen, Yi Lei, Gabriele Liga, Zhiwei Liang, Wei Ling, Xuwei Xue, Alex Alvarado

CoRR, 2022

Shaped Four-Dimensional Modulation Formats for Optical Fiber Communication Systems.

Bin Chen, Gabriele Liga, Yi Lei, Wei Ling, Zhengyan Huan, Xuwei Xue, Alex Alvarado

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

2021

Low-Complexity Geometrical Shaping for 4D Modulation Formats via Amplitude Coding.

Bin Chen, Wei Ling, Yunus Can Gültekin, Yi Lei, Chigo Okonkwo, Alex Alvarado

CoRR, 2021

2018

Lite-Service: A Framework to Build and Schedule Telecom Applications in Device, Edge and Cloud.

Wei Ling, Chen Tian, Lin Ma, Ziang Hu

Proceedings of the 20th IEEE International Conference on High Performance Computing and Communications; 16th IEEE International Conference on Smart City; 4th IEEE International Conference on Data Science and Systems, 2018

2009

Thermal design of central office telecommunication equipment.

Wei Ling, Salvatore J. Messana, Paul M. Rominski

Bell Labs Tech. J., 2009

2005

Analysis of Wave-Pipelined Domino Logic Circuit and Clocking Styles Subject to Parametric Variations.

Wei Ling, Yvon Savaria

Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005