Wei Chih Liu

According to our database, Wei Chih Liu authored at least 1 paper in 2015.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of seven.

2015

Study of Al-Cu compounds as soldering bond pad for high-power device packaging.

Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu

Microelectron. Reliab., 2015