Wei-Cheng Wu

Orcid: 0000-0002-9211-6224

According to our database1, Wei-Cheng Wu authored at least 19 papers between 2008 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Fine-grained Coverage-based Fuzzing - RCR Report.
ACM Trans. Softw. Eng. Methodol., June, 2024

Fine-grained Coverage-based Fuzzing.
ACM Trans. Softw. Eng. Methodol., June, 2024

A Novel Method for Audiogram Digitization in Audiological Reports.
IEEE Access, 2024

2022
An efficient virtualized network function deployment scheme for service function chain using deep Q-network.
Int. J. Commun. Syst., 2022

Harm-DoS: Hash Algorithm Replacement for Mitigating Denial-of-Service Vulnerabilities in Binary Executables.
Proceedings of the 25th International Symposium on Research in Attacks, 2022

2021
PERFUME: Programmatic Extraction and Refinement for Usability of Mathematical Expression.
Proceedings of the Checkmate@CCS 2021, 2021

PyCT: A Python Concolic Tester.
Proceedings of the Programming Languages and Systems - 19th Asian Symposium, 2021

2020
Efficient handling of string-number conversion.
Proceedings of the 41st ACM SIGPLAN International Conference on Programming Language Design and Implementation, 2020

2019
J-ReCoVer: Java Reducer Commutativity Verifier.
Proceedings of the Programming Languages and Systems - 17th Asian Symposium, 2019

2016
A 64-Kb 0.37V 28nm 10T-SRAM with mixed-Vth read-port and boosted WL scheme for IoT applications.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2016

2015
A 16 nm 128 Mb SRAM in High-κ Metal-Gate FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications.
IEEE J. Solid State Circuits, 2015

2014
13.5 A 16nm 128Mb SRAM in high-κ metal-gate FinFET technology with write-assist circuitry for low-VMIN applications.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2013
A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms.
IEEE J. Solid State Circuits, June, 2013

2011
A 130 mV SRAM With Expanded Write and Read Margins for Subthreshold Applications.
IEEE J. Solid State Circuits, 2011

Visual Fire Detection Based on Data Mining Technique.
Proceedings of the First International Conference on Robot, Vision and Signal Processing, 2011

Applying green goodwill for project management on green economics concept.
Proceedings of the 2011 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM), 2011

Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM).
Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011

2009
Risk evaluation of green components to hazardous substance using FMEA and FAHP.
Expert Syst. Appl., 2009

2008
Reversible Fragile Watermarking for E-Learning Media.
Proceedings of the Advances in Multimedia Information Processing, 2008


  Loading...