Wangkun Jia

According to our database, Wangkun Jia authored at least 2 papers between 2016 and 2022.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of four.

2022

A methodology for thermal simulation of interconnects enabled by model reduction with material property variation.

Wangkun Jia, Ming-C. Cheng

J. Comput. Sci., 2022

2016

Fast Thermal Simulation of FinFET Circuits Based on a Multiblock Reduced-Order Model.

Wangkun Jia, Brian T. Helenbrook, Ming-C. Cheng

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016