Wahyuaji Narottama Putra
Orcid: 0000-0002-0294-3606
According to our database1,
Wahyuaji Narottama Putra
authored at least 2 papers
between 2011 and 2013.
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Bibliography
2013
Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.
Microelectron. Reliab., 2013
2011
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011