W. S. Leong

According to our database, W. S. Leong authored at least 2 papers between 2002 and 2003.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2003

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.

T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu

Microelectron. Reliab., 2003

2002

The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.

T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai

Microelectron. Reliab., 2002