Vladimir Pasca

According to our database, Vladimir Pasca authored at least 13 papers between 2008 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

CSL: Configurable Fault Tolerant Serial Links for Inter-die Communication in 3D Systems.

Vladimir Pasca, Lorena Anghel, Michael Nicolaidis, Mounir Benabdenbi

J. Electron. Test., 2012

Kth-Aggressor Fault (KAF)-based Thru-Silicon-Via Interconnect Built-In Self-Test and Diagnosis.

Vladimir Pasca, Lorena Anghel, Mounir Benabdenbi

J. Electron. Test., 2012

Through-silicon-via built-in self-repair for aggressive 3D integration.

Michael Nicolaidis, Vladimir Pasca, Lorena Anghel

Proceedings of the 18th IEEE International On-Line Testing Symposium, 2012

Efficient link-level error resilience in 3D NoCs.

Vladimir Pasca, Saif-Ur Rehman, Lorena Anghel, Mounir Benabdenbi

Proceedings of the IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2012

2011

Configurable Thru-Silicon-Via interconnect Built-In Self-Test and diagnosis.

Vladimir Pasca, Lorena Anghel, Mounir Benabdenbi

Proceedings of the 12th Latin American Test Workshop, 2011

I-BIRAS: Interconnect Built-In Self-Repair and Adaptive Serialization in 3D Integrated Systems.

Michael Nicolaidis, Vladimir Pasca, Lorena Anghel

Proceedings of the 16th European Test Symposium, 2011

2010

Configurable serial fault-tolerant link for communication in 3D integrated systems.

Vladimir Pasca, Lorena Anghel, Claudia Rusu, Mounir Benabdenbi

Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

Interconnect Built-In Self-Repair and Adaptive-Serialization (I-BIRAS) for 3D integrated systems.

Michael Nicolaidis, Vladimir Pasca, Lorena Anghel

Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

Configurable fault-tolerant link for inter-die communication in 3D on-chip networks.

Vladimir Pasca, Lorena Anghel, Claudia Rusu, Mounir Benabdenbi

Proceedings of the 15th European Test Symposium, 2010

Fault tolerant communication in 3D integrated systems.

Vladimir Pasca, Lorena Anghel, Mounir Benabdenbi

Proceedings of the IEEE/IFIP International Conference on Dependable Systems and Networks Workshops (DSN-W 2010), Chicago, Illinois, USA, June 28, 2010

Error resilience of intra-die and inter-die communication with 3D spidergon STNoC.

Vladimir Pasca, Lorena Anghel, Claudia Rusu, Riccardo Locatelli, Massimo Coppola

Proceedings of the Design, Automation and Test in Europe, 2010

2009

Impersonation Attacks on a Mobile Security Protocol for End-to-End Communications.

Reiner Dojen, Vladimir Pasca, Tom Coffey

Proceedings of the Security and Privacy in Mobile Information and Communication Systems, 2009

2008

Determining a parallel session attack on a key distribution protocol using a model checker.

Vladimir Pasca, Anca Jurcut, Reiner Dojen, Tom Coffey

Proceedings of the MoMM'2008 - The 6th International Conference on Advances in Mobile Computing and Multimedia, 24, 2008