Viveka Konandur Rajanna

Orcid: 0000-0001-5353-7109

According to our database1, Viveka Konandur Rajanna authored at least 14 papers between 2016 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
122.7 TOPS/W Stdcell-Based DNN Accelerator Based on Transition Density Data Representation, Clock-Less MAC Operation, Pseudo-Sparsity Exploitation in 40 nm.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023
Visual Content-Agnostic Novelty Detection Engine with 2.4 pJ/pixel Energy and Two-Order of Magnitude DNN Activity Reduction in 40 nm.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

ECC-Less Multi-Level SRAM Physically Unclonable Function and 127% PUF-to-Memory Capacity Ratio with No Bitcell Modification in 28nm.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Energy-Efficient Computation in Constrained Systems with Machine Learning Workloads.
Proceedings of the IEEE International Symposium on Smart Electronic Systems, 2023

Single-Antenna Backscattered BLE5 Transmitter with up to 97m Range, 10.6 μW Peak Power for Purely-Harvested Green Systems.
Proceedings of the 49th IEEE European Solid State Circuits Conference, 2023

2022
In-Memory Unified TRNG and Multi-Bit PUF for Ubiquitous Hardware Security.
IEEE J. Solid State Circuits, 2022

Fully-Digital Broadband Calibration-Less Impedance Monitor for Probe Insertion Detection against Power Analysis Attacks.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

DDPMnet: All-Digital Pulse Density-Based DNN Architecture with 228 Gate Equivalents/MAC Unit, 28-TOPS/W and 1.5-TOPS/mm2 in 40nm.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2022

2021
On-Chip Links With Energy-Quality Tradeoff in Error-Resilient and Machine Learning Applications.
IEEE J. Solid State Circuits, 2021

Fully-Digital Self-Calibrating Decoder with Sub-µW, 1.6fJ/convstep and 0.0075mm<sup>2</sup> per Receptor for Scaling to Human-Like Tactile Sensing Density.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

36.1 Unified In-Memory Dynamic TRNG and Multi-Bit Static PUF Entropy Generation for Ubiquitous Hardware Security.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021

SRAM with In-Memory Inference and 90% Bitline Activity Reduction for Always-On Sensing with 109 TOPS/mm<sup>2</sup> and 749-1, 459 TOPS/W in 28nm.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2019
Low-Swing Links with Dynamic Energy-Quality Trade-off for Error-Resilient Applications.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2019

2016
A Variation-Tolerant Replica-Based Reference-Generation Technique for Single-Ended Sensing in Wide Voltage-Range SRAMs.
IEEE Trans. Very Large Scale Integr. Syst., 2016


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