Vesa Vuorinen

According to our database, Vesa Vuorinen authored at least 4 papers between 2007 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects.

Glenn Ross, Vesa Vuorinen, Michael Krause, S. Reissaus, Matthias Petzold, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2017

2016

Optimization of contact metallizations for reliable wafer level AuSn bonds.

Vesa Vuorinen, Antti Rautiainen, Hannele Heikkinen, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2016

2009

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers.

Tomi Laurila, J. Hurtig, Vesa Vuorinen, Jorma K. Kivilahti

Microelectron. Reliab., 2009

2007

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.

Tomi Laurila, Toni T. Mattila, Vesa Vuorinen, Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti

Microelectron. Reliab., 2007