Verena Hein

According to our database, Verena Hein authored at least 7 papers between 2012 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization.

Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai

Microelectron. Reliab., 2016

2014

Degradation behavior in upstream/downstream via test structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács

Microelectron. Reliab., 2014

Evaluation new corner stress relief structure layout for high robust metallization.

Verena Hein, Jörg Kludt, Kirsten Weide-Zaage

Microelectron. Reliab., 2014

2013

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.

Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen

Microelectron. Reliab., 2013

Dynamic simulation of octahedron slotted metal structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2013

2012

Simulation of the influence of TiAl₃ layers on the thermal-electrical and mechanical behaviour of Al metallizations.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2012

A design for robust wide metal tracks.

Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage

Microelectron. Reliab., 2012