Veerle Simons

According to our database, Veerle Simons authored at least 7 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure.

O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2022

Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors.

Kristof Croes, Veerle Simons, Brecht Truijen, Philippe Roussel, Koen Van Sever, Artemisia Tsiara, Jacopo Franco, Philippe Absil

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

Assessment of critical Co electromigration parameters.

O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2019

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

2004

Creep as a reliability problem in MEMS.

Robert Modlinski, Ann Witvrouw, Petar Ratchev, Anne Jourdain, Veerle Simons, H. A. C. Tilmans, Jaap M. J. den Toonder, Robert Puers, Ingrid De Wolf

Microelectron. Reliab., 2004