Vasileios Gerakis

According to our database, Vasileios Gerakis authored at least 8 papers between 2014 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

A Low-Cost, Robust and Tolerant, Digital Scheme for Post-Bond Testing and Diagnosis of TSVs.

Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis A. Hatzopoulos

J. Electron. Test., 2021

2020

An Alternative Post-bond Testing Method for TSVs.

Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis A. Hatzopoulos

Proceedings of the 9th International Conference on Modern Circuits and Systems Technologies, 2020

2017

Oscillation-based technique for post-bond parallel testing and diagnosis of multiple TSVs.

Stylianos-Georgios Papadopoulos, Vasileios Gerakis, Yiorgos Tsiatouhas, Alkis A. Hatzopoulos

Proceedings of the 27th International Symposium on Power and Timing Modeling, 2017

Oscillation-based technique for TSV post-bond test considerations.

Stylianos-Georgios Papadopoulos, Vasileios Gerakis, Alkis A. Hatzopoulos

Proceedings of the 6th International Conference on Modern Circuits and Systems Technologies, 2017

2015

Fault modeling and testing of through silicon via interconnections.

Vasileios Gerakis, Leonidas Katselas, Alkis A. Hatzopoulos

Proceedings of the 21st IEEE International On-Line Testing Symposium, 2015

Modeling the Coupling through Substrate for Frequencies up to 100GHz.

Vasileios Gerakis, Fontounasios Christos, Alkis A. Hatzopoulos

Proceedings of the 18th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2015

2014

Substrate coupling noise considerations for frequencies up to 100GHz.

Vasileios Gerakis, Alkis A. Hatzopoulos

Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, 2014

Modeling and analysis of cracked through silicon via (TSV) interconnections.

Vasileios Gerakis, Christina Avdikou, Alexandros Liolios, Alkis A. Hatzopoulos

Proceedings of the 17th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2014