Valeriy Sukharev
Orcid: 0000-0002-5647-0584
According to our database1,
Valeriy Sukharev
authored at least 36 papers
between 2001 and 2024.
Collaborative distances:
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Bibliography
2024
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects.
Proceedings of the 2024 International Symposium on Physical Design, 2024
Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis.
Proceedings of the IEEE International Reliability Physics Symposium, 2024
A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments.
Proceedings of the IEEE International Reliability Physics Symposium, 2024
A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses.
Proceedings of the IEEE International Reliability Physics Symposium, 2024
2023
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.
Proceedings of the 2023 International Symposium on Physical Design, 2023
Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
2022
Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022
Proceedings of the ISPD 2022: International Symposium on Physical Design, Virtual Event, Canada, March 27, 2022
Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2022
2020
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020
2019
Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper).
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages.
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the International Conference on Computer-Aided Design, 2019
An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018
2017
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing.
Integr., 2017
Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems.
Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017
2016
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016
Electromigration assessment for power grid networks considering temperature and thermal stress effects.
Integr., 2016
Proceedings of the 35th International Conference on Computer-Aided Design, 2016
Learning-based dynamic reliability management for dark silicon processor considering EM effects.
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016
Proceedings of the 53rd Annual Design Automation Conference, 2016
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016
2015
Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2015
Proceedings of the 52nd Annual Design Automation Conference, 2015
New electromigration modeling and analysis considering time-varying temperature and current densities.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015
2014
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Lifetime optimization for real-time embedded systems considering electromigration effects.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Proceedings of the 51st Annual Design Automation Conference 2014, 2014
2012
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance.
J. Electron. Test., 2012
2010
Proceedings of the 47th Design Automation Conference, 2010
2009
Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation.
Proceedings of the 10th International Symposium on Quality of Electronic Design (ISQED 2009), 2009
2005
Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2005
2004
Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004
2001
Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps.
Microelectron. Reliab., 2001