Uwe Kerst

Affiliations:
  • TU Berlin, Department of High-Frequency and Semiconductor System Technologies, Germany


According to our database1, Uwe Kerst authored at least 14 papers between 2005 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2015
A BIST structure for the evaluation of the MOSFET gate dielectric interface state density in post-processed CMOS chips.
Proceedings of the ESSCIRC Conference 2015, 2015

2014
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm.
Microelectron. Reliab., 2014

2013
Security Risks Posed by Modern IC Debug and Diagnosis Tools.
Proceedings of the 2013 Workshop on Fault Diagnosis and Tolerance in Cryptography, 2013

2012
On charge sensors for FIB attack detection.
Proceedings of the 2012 IEEE International Symposium on Hardware-Oriented Security and Trust, 2012

2010
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments.
Microelectron. Reliab., 2010

Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC.
Microelectron. Reliab., 2010

2009
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing.
Microelectron. Reliab., 2009

2008
Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology.
Microelectron. Reliab., 2008

Physical Techniques for Chip-Backside IC Debug in Nanotechnologies.
IEEE Des. Test Comput., 2008

2007
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy.
Microelectron. Reliab., 2007

Backside E-Beam Probing on Nano scale devices.
Proceedings of the 2007 IEEE International Test Conference, 2007

2006
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node.
Microelectron. Reliab., 2006

2005
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations.
Microelectron. Reliab., 2005

Impact of back side circuit edit on active device performance in bulk silicon ICs.
Proceedings of the Proceedings 2005 IEEE International Test Conference, 2005


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