Tz-Cheng Chiu

According to our database, Tz-Cheng Chiu authored at least 5 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging.

Tz-Cheng Chiu, En-Yu Yeh

Microelectron. Reliab., 2018

2015

Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics.

Tz-Cheng Chiu, Bo-Sheng Lee, Dong-Yi Huang, Yu-Ting Yang, Yi-Hsiu Tseng

Microelectron. Reliab., 2015

2012

A numerical procedure for simulating delamination growth on interfaces of interconnect structures.

Tz-Cheng Chiu, Chun-Hui Chen

Microelectron. Reliab., 2012

2011

Warpage evolution of overmolded ball grid array package during post-mold curing thermal process.

Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai

Microelectron. Reliab., 2011

2010

Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load.

Tz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta

Microelectron. Reliab., 2010