Tsung-Yueh Tsai

According to our database, Tsung-Yueh Tsai authored at least 5 papers between 2007 and 2010.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2010

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.

Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere

Microelectron. Reliab., 2010

2009

High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys.

S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai

Microelectron. Reliab., 2009

2008

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.

Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Microelectron. Reliab., 2008

2007

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.

Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai

Microelectron. Reliab., 2007

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.

Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen

Microelectron. Reliab., 2007