Tsung-Nan Tsai
Orcid: 0000-0003-1395-1350
According to our database1,
Tsung-Nan Tsai
authored at least 16 papers
between 2004 and 2016.
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Bibliography
2016
Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method.
Appl. Soft Comput., 2016
2015
Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system.
J. Intell. Fuzzy Syst., 2015
2014
Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method.
Microelectron. Reliab., 2014
A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly.
J. Intell. Manuf., 2014
Selection of the optimal configuration for a flexible surface mount assembly system based on the interrelationships among the flexibility elements.
Comput. Ind. Eng., 2014
2013
An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly.
Int. J. Comput. Integr. Manuf., 2013
2012
Development of a soldering quality classifier system using a hybrid data mining approach.
Expert Syst. Appl., 2012
Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study.
Appl. Soft Comput., 2012
2009
Selection of the optimum promotion mix by integrating a fuzzy linguistic decision model with genetic algorithms.
Inf. Sci., 2009
2008
Comput. Ind. Eng., 2008
2005
Int. J. Syst. Sci., 2005
Development of an integrated reflow soldering control system using incremental hybrid process knowledge.
Expert Syst. Appl., 2005
Developing a multi-layer reference design retrieval technology for knowledge management in engineering design.
Expert Syst. Appl., 2005
A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly.
Eng. Appl. Artif. Intell., 2005
2004
A neurofuzzy-based quality-control system for fine pitch stencil printing process in surface mount assembly.
J. Intell. Manuf., 2004