Tridib Lochan Dutta

According to our database, Tridib Lochan Dutta authored at least 2 papers between 2023 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Too Hot to Handle: Novel Thermal Side-Channel in Power Attack-Protected Intel Processors.

Nimish Mishra, Tridib Lochan Dutta, Shubhi Shukla, Anirban Chakraborty, Debdeep Mukhopadhyay

Proceedings of the IEEE International Symposium on Hardware Oriented Security and Trust, 2024

2023

Performances of M2M Protocols in Internet of Medical Things.

Kunal Das, Tridib Lochan Dutta, Kumarjit Ray, Rajdeep Ghosh, Debangee Goswami, Adittya Dey, Prabhatangshu Phukan, Pritindra Das, Vicky Kumar Deka, Nabajyoti Medhi

Proceedings of the IEEE International Conference on Communications, 2023