Toshio Sudo
According to our database1,
Toshio Sudo
authored at least 6 papers
between 1995 and 2013.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2004, "For contributions to high-density packaging.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2013
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
2011
PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2009
Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2005
Radiated Harmonics Characterization of CMOS Test Chip with On-Chip Decoupling Capacitance.
IEICE Trans. Commun., 2005
1995
IEEE J. Solid State Circuits, April, 1995